Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 7C-02
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Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Improving the Quality of Dielectric Film and the Application to Wafer Level Film Preparation
*Kazutaka Sueshige, Keita Iimura, Masaaki Ichiki, Tadatomo Suga, Toshihiro Itoh
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Keywords: film, MOD, wafer level, piezoelectric, ferroelectric
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[in Japanese]
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© 2012 The Japan Institute of Electronics Packaging
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