Proceedings of JIEP Annual Meeting
The 27th JIEP Annual Meeting
Session ID : 13A-01
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Host: Japan Institute of Electronics Packaging

The 27th JIEP Annual Meeting
Activity of device embedding technical committee and the trend of device embedded substrate
*Katsumi Miyama
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Keywords: Device embedded substrate
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[in Japanese]
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© 2013 The Japan Institute of Electronics Packaging
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