Abstract
Embedding uses PCB (Printed-Circuit Board) processes for 3D integration of active and passive elements to create SiPs (System in Package).Inherent advantages include:- Significant form factor reduction through integration- Compatibility with traditional SMT processes, in particular with regards to pitch,- Production batch size- Historical reliability and process data- Thermal management- Possibility to integrate EMI shielding- CTE matchingThis is introduction to some of the advantages, latest capabilities, and successful volume applications of AT&S’ ECP? technology.
