Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 5B-14
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Reliability Test for Device Embedded Substrates using Four-Point Bending Method
*Shintaro So, Tomohiro Takeuchi, Kansuke Ikehara, Kyosuke Nanami, Younggun Han, Osamu Horiuchi, Woon Choi, Yoshihisa Katoh, Hajime Tomokage
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Keywords: Reliability Test, Four-Point Bending Method, Embedded Devices
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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