Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7A-05
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Influence of a surface treatment on the Copper to Copper bonding using Platinum catalyst formic acid processing
*Naoya Matsuoka, Masatake Akaike, Tadatomo Suga
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Keywords: Direct Bonding, Pt Catalyst, Low　Temperature, Formic Acid, Cu Oxide
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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