Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7A-10
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Cu wire bondability of laser-sintered Ag nanoparticle films
*Mengqing Liu, kazuhiko Yamasaki, Mamoru Mita, Katsuhiro Maekawa
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Keywords: High-speed laser printing, inkjet, nickel plating
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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