Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7C-08
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Room Temperature Bonding of Wafers using Ag Films in Air
*Hitoe Kon, Miyuki Uomoto, Takehito Shimatsu
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Keywords: room temperature bonding, Ag films, wafers, atomic diffusion
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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