Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7C-11
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Novel soldering technique using self-propagating exothermic materials for MEMS hermetic packages
*Takahiro Namazu
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Keywords: Self-propagating exothermic material, MEMS hermetic packaging, Solder bonding
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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