The 28th JIEP Annual Meeting
Session ID : 5PD-12
Conference information
Host: Japan Institute of Electronics Packaging
The 28th JIEP Annual Meeting
Evaluation of Low Cycle Fatigue Properties of Electroplated Copper Thin Film for Through Hole Via
*Naoyuki Yajima, Yoshiharu Kariya, Shunichi Kikuchi, Yoshiyuki Hiroshima, Akiko Matsui, Hiroshi Shimizu
Author information
Keywords:
Electroplated copper thin film,
Low Cycle Fatigue
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