Proceedings of JIEP Annual Meeting
The 31st JIEP Annual Meeting
Session ID : 7C1-2
Conference information

Host: Japan Institute of Electronics Packaging

The 31st JIEP Annual Meeting
Effect of resin characteristic and board configuration on bending displacement of device embedded substrate
*[in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (551K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2017 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top