Proceedings of JIEP Annual Meeting

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The 31st JIEP Annual Meeting

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The 31st JIEP Annual Meeting

Optimum design of printed circuit board from long practical experience

[in Japanese]

Session ID: 6B1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_42

CONFERENCE PROCEEDINGS FREE ACCESS

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An example of short failure between terminals in BGA with underfill material

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6B1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_46

CONFERENCE PROCEEDINGS FREE ACCESS

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Development of thermal fatigue-resistant active metal brazing substrates using highly-thermal conductive silicon nitrides

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6B1-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_49

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (215K)
Initial Defects in Electroless Nickel Layers on Copper-Metallized Substrates Induced by Thermal Cycling

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6B1-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_50

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (239K)
In-situ Observation of Die-attached Joints with Cyclic Energization by Synchrotron Radiation Laminography

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6B1-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_51

CONFERENCE PROCEEDINGS FREE ACCESS

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Effects on Printed Circuit Board of Vibration Stress in Highly Accelerated Limit Test

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6B1-6
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_54

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (547K)
Online Interconnect Test Method of Assembled PCB Circuits with IEEE 1149.1 Test Circuits

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6B2-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_58

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (474K)
Test Circuit for Interconnect Tests Based on The Number of Charging Times

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6B2-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_62

CONFERENCE PROCEEDINGS FREE ACCESS

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A research pertaining to capacitance type inspection system

[in Japanese]

Session ID: 6B2-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_66

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (539K)
SJI(Solder-Joint-Inspection) 30 years and issues to be solved based on 3D technology

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6B3-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_70

CONFERENCE PROCEEDINGS FREE ACCESS

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Discrimination of thin stains and foreign particles on electronic parts’ surface

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6B3-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_74

CONFERENCE PROCEEDINGS FREE ACCESS

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Microscopic observation on latent flaws using non-contact stress-induced light scattering method

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6B3-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_76

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (710K)
Evaluation Technique by Digitizing without Teacher Data for Nonuniformity in Platings and Its Standardization

[in Japanese], [in Japanese]

Session ID: 6B3-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_79

CONFERENCE PROCEEDINGS FREE ACCESS

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Development of High Tg Epoxy Resin with Rigid Chemical Structure

[in Japanese]

Session ID: 6C1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_83

CONFERENCE PROCEEDINGS FREE ACCESS

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Study of low elastic prepreg for reduction of solder crack

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6C1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_85

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of viscosity change of resin on coalescence behavior of solder particles during self-organization packaging process

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6C1-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_89

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1091K)
Analysis of Curing Process of Electrically Conductive Adhesives Based on a Reaction Kinetic Approach

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6C1-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_91

CONFERENCE PROCEEDINGS FREE ACCESS

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Development of High Sensitive Photo-Initiators and Related Materials

[in Japanese]

Session ID: 6C1-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_95

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (288K)
Ultra Low Loss Build-up Film for Fine Pitch Applications

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6C2-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_97

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (533K)
Synthesis of highly-crystalline single-walled carbon nanotubes dispersed ink

[in Japanese], [in Japanese], [in Japanese]

Session ID: 6C2-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_101

CONFERENCE PROCEEDINGS FREE ACCESS

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Effect of Blasting Air Pressure on Metal/Polymer Direct Joining

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6C2-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_102

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (713K)
Influence of temperature and additional element on the tensile property of low Ag lead free solder

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6C2-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_105

CONFERENCE PROCEEDINGS FREE ACCESS

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Pressure-less and low-temperature bonding with nano/submicron Ag powder composite

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 6C2-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_107

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (425K)
Morphology of the interfacial layer formed on Ni added lead free solder

[in Japanese], [in Japanese]

Session ID: 6P1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_157

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1098K)
Fabrication of optical waveguide in a TiO₂/PDMS composite material by proton beam writing

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6P1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_161

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (406K)
Frequency dependence of trapping Au nanoparticles in PMMA-micro pit arrays by Dielectrophoresis

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6P1-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_163

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (621K)
Coupling Coefficients of Broadside Coupled riangular esonator

[in Japanese], [in Japanese]

Session ID: 6P1-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_166

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (445K)
Basic Study on a Design Method of Lumped Elements Matching Circuit of Diplexers for Creating an Attenuation Pole

[in Japanese], [in Japanese]

Session ID: 6P1-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_168

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (490K)
A study of nondestructive electric current density imaging n connector contact portion

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 6P1-6
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_170

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (2036K)
Development of Pressure-less Sintering Copper Die-bonding Paste

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_173

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (341K)
Development of Pressure-less Sintering Copper Die-bonding Paste-Power Cycling Performance of Sinterd Copper Bonding Layer in Power Device-

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_175

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (761K)
Thermal stability improvement of sintered Ag materials by addition of tungsten compound particles

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A1-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_178

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (465K)
Stability improvement of silver sintering process for highly thermal-resist power device packaging

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A1-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_180

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (717K)
High-temperature reliability using metal-sinter die-attach for SiC power device

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A1-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_184

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (415K)
Metallization Technology of Power Module for High Temperature Operation

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A2-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_188

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (998K)
Influence of Phosphorous and Sulfur Content in Electroless Ni-P Plating Film on Film Properties.

[in Japanese], [in Japanese], [in Japanese]

Session ID: 7A2-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_192

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (522K)
A full SiC module operational at 200゜C junction realized by a low thermal strain structure

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A2-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_194

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (585K)
Active Metal Brazing Substrate Warpage Analysis with Thermal History

[in Japanese], [in Japanese], [in Japanese]

Session ID: 7A2-4
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_197

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (783K)
Study of Temperature Rise of Small Chip Components in case of Dense Mounting

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7A2-5
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_201

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (512K)
Development of micro-bump formation technology by sputtering

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7B1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_205

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (453K)
Investigation on effect of reduction of silver content in conductive adhesives by using Ag-plated resin particles

[in Japanese], [in Japanese]

Session ID: 7B1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_208

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (615K)
Study on Semiconductor Interconnection Technology Using Ni nanoparticles

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7B1-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_210

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (349K)
Effect of Current Load at Relative Low Temperature on Microstructure of Copper Joined by Lead-free Sn-based Solder

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7B2-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_213

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (718K)
Reliability Evaluation Technology of Sn-Sb-Cu-Ni Solder with High Cu Addition.

[in Japanese], [in Japanese]

Session ID: 7B2-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_217

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (336K)
Installation reliability of transparent flexible wiring board with sensor mounted on structure

[in Japanese]

Session ID: 7B2-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_219

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1156K)
Force and Heat Transmitted by a Molecular Junction

[in Japanese]

Session ID: 7B3-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_221

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (329K)
Development of photocationic polymerizable adhesive

[in Japanese]

Session ID: 7B3-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_223

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (425K)
Development of the novel UV curable aqueous materials

[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japane ...

Session ID: 7B3-3
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_225

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (1016K)
Latest Boundary-Scan Test Technology for Device Embedded Substrates

[in Japanese]

Session ID: 7C1-1
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_229

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (534K)
Effect of resin characteristic and board configuration on bending displacement of device embedded substrate

[in Japanese], [in Japanese], [in Japanese], [in Japanese]

Session ID: 7C1-2
Published: 2017
Released on J-STAGE: January 29, 2019

DOIhttps://doi.org/10.11486/ejisso.31.0_232

CONFERENCE PROCEEDINGS FREE ACCESS

Download PDF (551K)

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