Proceedings of JIEP Annual Meeting
The 38th JIEP Annual Meeting
Session ID : 13A6-1
Conference information

Host: Japan Institute of Electronics Packaging

The 38th JIEP Annual Meeting
Evaluation of heat resistance of low-pressure Cu sinter bonding based on particle morphology control by thermal plasma
*[in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details
Download PDF (1828K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2024 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top