2018 Volume 16 Pages 172-176
The CeO2 NP layer on Al2O3(0001) prepared by dipping method using CeO2 NPs colloid solution showed less contacted state among the primary particles even after heat treatment at 1000°C in air. The surface reduction behavior of CeO2 NP layer on Al2O3(0001) was investigated by XPS under the Ar+ sputtering in vacuum. The result indicates that Ar+ sputtering induced a considerable reduction of CeO2 NP layer on Al2O3(0001) and its final ratio of Ce3+ was 79%. In comparison with CeO2 powder, the difference between their final ratio of Ce3+ (79% and 68%) was small. Therefore, it was indicated that the Ar+ sputtering induced the reduction of Ce4+ to Ce3+ in CeO2 by mainly physical effect, however the chemical effect in low oxygen pressure could be attributed to the local thermal energy transfer induced by kinetic energy of Ar+ ions. The substrate-stabilized and dispersed CeO2 NPs showed slightly accelerated capacity in reducing behavior of CeO2. [DOI: 10.1380/ejssnt.2018.172]