Abstract
In the recent drastic evolution of high-density and high-frequency electronic circuit technologies, various noise problems have become critical. With the rapid technological improvements in IC packaging and printed circuit board manufacturing as well as in LSI chip design, the design methodologies have become complex and require efficient three-dimensional (3D) modeling. Furthermore, a paradigm shift in semiconductor design from two demensions to three dimensions is occurring in an attempt to break through the Moore’s law. In 3D designs, one of the most critical issues is how to meet the requirements for the signal and power integrity and the EMI effects, and, as a result, simulation technology has become increasingly important. In this report, the current status and future trend of 3D electromagnetic/ circuit simulation technology are described. After the introduction, a historical overview and the current status of 3D electrical simulation techniques are described. Next, a variety of advanced simulation algorithms are introduced for efficient time-domain analysis. Furthermore, several types of hardware-oriented acceleration techniques based on PC clusters and GPGPU are discussed.
