Abstract
Copper filaments were prepared by the glass conjugated melt spinning with changing the winding speed and cooling. Residual stress in the filaments was determined by the X-ray diffraction of the reflecting planes of (400), (222) and (220). The following results were obtained.
1) The residual stress in copper filament obtained by changing the winding speed from 137m/min to 50m/min is compressive and increases with increasing winding speed. The residual stress in the reflecting plane decreased in the following order; (400)>(220)>(222).
The dependency of the residual stress of copper filament is theoretically interpreted by Taira's analysis.
(2) When the copper filament surface is treated by the electro polishing method, the compressive residual stress decreases with polyshing time and a constant compressive stress, which is larger on (220) than others, is found after the polishment for more than 20 seconds.
(3) Large compressive residual stress of copper filament after the cooling treatment was found and was larger on (220) than (222).
