Abstract
Before last time we reported that Au and Pd enriched due to Ag ellution from Ag-Pd-Au-Cu alloy by (1) immersion in nitric acid and (2) immersion in sodium thiosulfate solution following the formation of argentic chloride by sodium hypochlorite dipping. Etch-pits were created on the alloy surface after treatment (2), which suggests the effect of metallographical segregation. In this study, we examined the effect of the solid solution heat treatment temperature on the crystal phase homogeneity and Ag selective dissolution of an Ag-Pd-Au-Cu alloy to search how to ellute this alloy uniformly.