2004 Volume 124 Issue 2 Pages 270-276
Mass production technology and new developments in Compound Semiconductor material for Microwave devices are here described. Semi-insulating GaAs was used for Microwave devices from the 1980s. Progress of Epi-taxial technology has enabled higher performance of these devices. Epi-wafers for HEMTs and HBTs are grown by MOVPE and MBE in mass production. Controllability of the growth and improvement of through-put have been carried out in both methods. Quality improvement of conventional technology is still important on a real stage for the next generation devices. The new materials, such as Metamorphic Wafers, InP related material and GaN-HEMT have been developed and are showing high performance. Compound Semiconductors will contribute significantly to the future of Microwave devices.
The transactions of the Institute of Electrical Engineers of Japan.C
The Journal of the Institute of Electrical Engineers of Japan