2021 Volume 141 Issue 8 Pages 856-859
An 8 Gbps high-speed relay MMIC for an Automated Test Equipment (ATE) using a gallium nitride is developed and evaluated. Metal-Insulator-Semiconductor structure with a tantalum oxynitride is employed to reduce a leakage current for ATE applications. The fabricated MMIC shows 0.3 nA of the leakage current, 12 GHz of a -3 dB bandwidth, and excellent eye-opening of 8 Gbps signals with a 18-leads QFN package. The MMIC has 2.0×2.4 mm of package size and achieves higher channel density than an existing photo relay generally applied in ATE.
The transactions of the Institute of Electrical Engineers of Japan.C
The Journal of the Institute of Electrical Engineers of Japan