IEEJ Transactions on Electronics, Information and Systems
Online ISSN : 1348-8155
Print ISSN : 0385-4221
ISSN-L : 0385-4221
<Electronic Materials and Devices>
Broadband-Packaging Technology and High-Speed Operation of Integrated Optical Front-End Module with InP Devices for Over 1 Tb/s/λ Optical Transmission
Hitoshi WakitaMunehiko NagataniHiroshi YamazakiYoshihiro OgisoMiwa MutohMinoru IdaFukutaro HamaokaMasanori NakamuraTakayuki KobayashiYutaka MiyamotoHideyuki Nosaka
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2022 Volume 142 Issue 3 Pages 360-366

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Abstract

We fabricated ultra-broadband integrated optical front-end module included InP analog multiplexer ICs and Mach-Zehnder modulator. In addition to the ultra-broadband characteristics of those InP devices, we carefully designed the substrate and interconnection of the module for minimizing the loss derived from assembling. As a result, the module revealed broad EO response of 80 GHz. We successfully generated QPSK signal at the speed of 192 GBaud and demonstrated a 1.3 Tb/s/λ optical transmission (168-GBaud PDM PS-64 QAM) with this module.

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© 2022 by the Institute of Electrical Engineers of Japan
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