抄録
In this paper, a model-based control method for RTP (Rapid Thermal Processing) system is proposed. RTP system is a device used to heat semiconductor wafers uniformly. It can heat wafers rapidly and reduce the processing time. However, it is very difficult for a RTP system to achieve the extremely stringent requirement on temperature uniformity (±1[K] or less) without suitably controlling and coordinating the radiative heat flux from the halogen lamps. In this research, the location of lamps is optimized first. Then, a feedback control system is designed which provides optimal temperature control during the thermal processing. The design is carried out based on a linearized model and H2 optimal control. The effect of sensor location is also investigated. Numerous simulations show that satisfactory performances are obtained in both the tracking and the uniformity of wafer temperature.
