シリコンチップの電子的・熱的・機械的特性を活かした両面放熱パワーモジュール開発の経緯

抄録

Since smaller thermal-resistance design is indispensable for automotive IGBT modules, the double-sided cooling power module and stacked cooler have been developed. However, it has not known that the FS-IGBT played an extremely important role in exquisite combination of. Therefore, we have reviewed the bottlenecks from the viewpoint of the power semiconductor chips in the power module, named as “Power-Card”, followed by the basic functions the chips should have. Further, we have recognized that the paradigm shift from “Power semiconductor device first” to “Power module first” has strongly pushed forward realization.