抄録
During the process of electrochemical machining (ECM), bubbles and sludge are generated in the inter-electrode gap, affecting the machining accuracy significantly. To solve this problem, an electrolyte flow is supplied into the gap to flush them away. Hence, this study aimed to observe the flow of electrolyte and bubbles in the gap using a transparent electrode. SiC single crystal semiconductor was used as the cathode material because it is electrically conductive and optically transparent. The gap was observed through the SiC cathode in the direction normal to the electrode surface using a high speed video camera. Distributions of the flow speed and diameter of bubbles were investigated to understand the influence of flushing flow on the machining process.
