3D Field Simulation of Magnetic Thin Film Inductor
2006 年 13 巻 2 号 p. 105-108
詳細
2006 年 13 巻 2 号 p. 105-108
The 3D magnetic field simulations with FEM (finite element method) have been performed to predict and understand the performance of Magnetic Thin Film Inductor (MTFI). Inductor structures of planar electroplated Cu spiral coil, which are sandwiched and underlaid with magnetic thin films, are considered as the simulation models. The inductance increment of 300% compared to air-core inductor was predicted when the sandwiched 5μm thickness magnetic thin film with relative permeability of 600 was adopted. Impedance measurement for the fabricated MTFI showed a good agreement with the simulation result. We also found that the undesirable increment of resistance at high frequency was originated from the eddy current flow through magnetic thin film.
