1990 年 30 巻 12 号 p. 1119-1123
It is well known that segregation of Ti and formation of TiN occurs when active brazing alloys such as Ag-Cu-Ti were used for Si3N4 joining. Si3N4-Si3N4 joining was carried out using several glass solders containing oxides of active metal, 1A group elements and 2A group elements without applying pressure. Si3N4-glass reaction and bonding behavior of these elements in Si3N4-Si3N4 joint were studied. The bonding strength obtained from Silicon nitride joints using glass solder in the system SiO2-Al2O3-Li2O was strong enough for practical application.
