1995 年 35 巻 10 号 p. 1298-1306
This study investigated bonding and the crystallization behavior of Ni-base single crystal superalloy, CMSX-2, base material during transient liquid phase (TLP) bonding using MBF-80 insert metal. Joint strength was evaluated using tensile and creep rupture testing at elevated temperature. TLP-bonding of CMSX-2 was carried out at 1373-1548 K for 0-19.6 ks in vacuum and the (001) plane of each test specimen was always aligned perpendicular to the joint interface. The dissolution width at the bonding temperature increased when the bonding temperature and holding time increased. The eutectic width decreased linearly with the square root of holding time during isothermal solidification. Electron back scattering patterns of completed joints revealed that the bonded layer had single-crystallized during the TLP-bonding process and matched the crystallographic orientation of the bonded substrates. The elevated temperature tensile strength and creep rupture strength of the joints were the identical ones of the base metal.
