Proceedings of the Japan Joint Automatic Control Conference
THE 54TH JAPAN JOINT AUTOMATIC CONTROL CONFERENCE
Session ID : 2C205
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Motion Control for Transfer system and Vibration (2)
Vibration Suppression Control of Semiconductor Wafer Transfer Robot by Building an Integrated Tool of Parameter Identification and Input Shaping
*Takahito YamashitaAribowo WisnuNaoki UchiyamaYoji MasuiToru SaekiToshio KamigakiHirotoshi KawamuraKazuhiko Terashima
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Abstract
High speed operation of industrial transfer robot arm generates residual vibration, which in many cases may limit productivity of the factory. In this paper, we use input shaping approach to reduce the residual vibration. The approach needs value of natural frequency and damping ratio to be identified in advance. We present an integrated tool of parameter identification and vibration control for higher modes vibration systems, as an easy and effective tool to help industrial people to analyze and solve the vibration problem. A semiconductor wafer transfer robot arm is used as an application case. Experiment has been carried out, and the results showed significant reduction in settling time as well as total movement time of the robot arm.
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© 2012 SICE
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