抄録
The LIGA process consists of lithography which use synchrotron radiation light, electroforming and molding has attracted attention in microstructure fabrication technology. At the molding process of LIGA process, a cast of especially high aspect ratio structure is assumed that it is difficult to pull out from the mold. But, mold releasability is improved by tapering the structure. In this research, The diffraction exposure technique is newly proposed. Diffraction is caused by providing a clearance between the resist and the mask. The structure fabricated is the lines and intermediate space whose processed depth is 200μm and designated the taper angle 5° as set point. The experiment was done by changing gap, dose and slit width. When dose is increased, processed width increased, but taper angle does not change. When gap is increased, both processed width and taper angle increased. When slit width is expanded, processed width increased, but taper angle decreased. The taper angle of 3.7 degrees was achieved under the conditions for slit width of 7μm, gap of 150mm and 15000 (mA·sec/mm).
