Record of 2018 Joint Conference of Electrical, Electronics and Information Engineers in Kyushu
Session ID : 11-2A-09
Conference information
Host: Committee of Joint Conference of Electrical, Electronics and Information Engineers in Kyushu
Name : [in Japanese]
Number : 71
Location : [in Japanese]
Date : September 27, 2018 - September 28, 2018
Power Cycle Test of SiC Power Module Using High Temperature Solder Joint at Maximum Junction Temperature of 250 Degrees C
Details
