Abstract
A negative resist was spin-coated on the surface of a 50-μm thick copper film, and was solidified as a protection film. A palladium layer was then electrodeposited on the other uncovered surface. After removing the protection film, the resist was again spin-coated on the copper surface, and a pattern of microslits was transferred by photolithography. After development, the microslits were electrolytically etched out. Thus a palladium membrane of 5 mm in diameter was formed as an assemblage of thin layers formed in the microslits. The palladium membranes prepared were characterized by SEM observation, as well as by permeation measurements for hydrogen and nitrogen at 573-873 K. The palladium membrane, which was 3 μm in thickness and formed on a polished copper film, showed separation factor of hydrogen to nitrogen of 120 at 873 K.
