抄録
The present study describes a low-temperature metal–metal bonding process using leaf-like CuO aggregates. A CuO nanoparticle colloid solution was prepared at 20°C with a salt-base reaction. Leaf-like CuO aggregates with a longitudinal size of ca. 990 nm and a lateral size of ca. 440 nm composed of CuO nanoparticles with a size of ca. 10 nm were fabricated by aging the CuO particle colloid solution at 80°C. The metal–metal bonding ability of the leaf-like CuO aggregates was examined by pressurizing metallic discs sandwiching the CuO particles as a filler at 1.2 MPa for 5 min under annealing in H2 gas. The metal–metal bonding could be performed even for an annealing temperature as low as 250°C. A shear strength of 17.0 MPa was recorded for the annealing temperature of 250°C.
