Film Formation Behavior of Copper in Synthetic Freshwater Containing Silica and Chloride Ion

Abstract

A film formed on copper plates immersed in the synthetic freshwater containing silica and chloride ion has been assessed using FT-IR, SEM, EPMA and cathodic reduction. The scale formed on copper plates immersed in 20 ppm Cl⁻ solution without silica composed mainly cuprous oxide (Cu₂O) and its morphology was angular shape with facet faces. Granular scales aggregated and deposited on copper plates immersed in the solution containing silica and increased in size and number with immersion period. The composition of the scale was found to be a silicon oxide containing siloxane bonds by FT-IR analysis.