Effects of Adsorbed Species on Shape Change in Ultrafine Cu Plating and Etching

Abstract

Shape changes of ultrafine metallic structures were observed in Cu-plating and etching processes under the influence of adsorbed species acting as inhibitors and accelerators. The curvature enhanced accelerator coverage mechanism is important to explain Cu plating of narrow and deep trenches in the Damascene process. Effects of inhibitors on shape changes in Cu etching are discussed using the mechanism.