The Impact of a Thermal Insulation Layer on the Seismic Performance of Energy-Efficient Buildings

抄録

Energy-efficient homes are constructed with a continuous and uniform thermal envelope and are commonly built on top of a thermal insulation (TI) layer that encloses the entire building. Lightweight aggregates such as foamed glass aggregate, expanded clay aggregate, and extruded polystyrene (XPS) insulation boards are commonly used as materials for the TI layer to prevent thermal bridging at the ground floor slab. However, the reinforced concrete slab foundation above the TI layer is susceptible to horizontal sliding during seismic loading. To improve the seismic behavior of buildings founded on TI layers, this study discussed the shear stiffness and damping characteristics of lightweight aggregates and three types of XPS boards through laboratory tests available in the literature. A 2-dimensional numerical analysis is performed, and the corresponding validation results of the simulations are presented. The effect of TI layers on the seismic performance of buildings constructed with TI layers made from these materials is assessed. A comparative analysis of various interface conditions of the TI materials under seismic loading is also conducted. Overall, this research aims to enhance the resilience and sustainability of energy-efficient homes by investigating the impact of TI layers on their seismic performance. The findings provide valuable insights for designing more robust structures that can withstand seismic events.