金属組織
溶体化および時効処理をしたCu–In合金の組織と特性
2020 年 59 巻 1 号 p. 54-58
詳細
2020 年 59 巻 1 号 p. 54-58
The microstructure, hardness and electrical conductivity of solution–treated and aged Cu–In（indium）alloys were investigated, and the effect of the microstructure on their properties were discussed. For solution–treated Cu–（0 to 7.5）at. ％ In alloys, the Vickers hardness and electrical resistivity increased linearly with increasing the indium content. It was found that indium addition in copper imparted a relatively high solid solution hardening and a low decrease rate of electrical conductivity, compared with other solute elements such as Sn and Ni. When aging was conducted, cellular components composed of a Cu solid solution and Cu7In3 intermetallic phases were nucleated and grown at grain boundaries, and eventually occupied overall the alloy. The hardness and electrical conductivity of the Cu–In alloys increased by aging. Hardening for the aged Cu–In alloy was explained by an increasing of volume fraction of Cu7In3 phase. The increase of electrical conductivity was principally due to developing the cellular components containing high conductive Cu solid solution phase.
