金属/セラミックス基複合材料接合に及ぼすCuとTiフィラー厚さの影響

抄録

The multi–materialization through bonding superalloy and SiC/SiC ceramic matrix composite is expected to bring a breakthrough in expanding the application range of SiC/SiC. In this study, we proposed Ni and SiC/SiC dissimilar joining using Nb interlayer with Cu and Ti filler. In particular, the effects of the filler thickness on the joint microstructure and strength of Nb/(SiC/SiC) side were investigated. Joining with the filler thickness ratio of Cu : Ti=2 : 1 caused Nb diffusion in liquid–phase, leading to the formation of Nb₅Si₃, which hindered stress relaxation. In contrast, the filler thickness ratio of Cu : Ti=4 : 1 suppressed Nb diffusion, resulting in the formation of only Cu solid solution without Nb₅Si₃, which effectively relaxed residual and bending stress. The room temperature bending strength of 67.6 MPa was obtained with 80 μm Cu/20 μm Ti.