軽金属
Online ISSN : 1880-8018
Print ISSN : 0451-5994
ISSN-L : 0451-5994
研究論文
電解コンデンサ用アルミニウム箔材におけるMCシミュレーションによる粒界移動予測
小林 正和高山 善匡加藤 一
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2002 年 52 巻 11 号 p. 547-552

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In order to control orientation distributions or texture in polycrystalline materials, it is important to study microstructural evolution, such as recrystallization and grain growth. In this study, microstructures have been observed in detail by using the SEM/EBSP orientation analyzing system before and after annealing during grain growth in an aluminum foil for electrolytic capacitor. The foil sample after the first annealing had a columnar structure with a few R-orientation grains in a cube texture. It was found that some grains disappeared after the second annealing. We carried out Monte Carlo simulation of grain growth in the Potts model applying orientations image data before the second annealing to an initial microstructure to predict microstructural evolution. Dependence of grain-boundary energy on misorientation was given on the basis of previous experimental knowledge in the simulation model. The simulation reproduced migrations in high angle grain-boundaries with disappearing of R-orientation grains and stable topological features in low angle grain-boundaries.
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© 2002 一般社団法人 軽金属学会
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