1990 Volume 40 Issue 3 Pages 195-201
Preform wires, which were organosilicone polymer (polycarbosilane) derived SiC fiber reinforced Al composite were high specific strength and high specific modulus. The thermal stability of those preform wires were investigated. Before and after exposure test at elevated temperature, the tensile strength of wires and extracted fibers were measured at room temperature. There was no degradation in the strength at 623K until 3600ks. In higher temperature, the strength of wires began to decrease gradually after about 108ks at 723K and after about 36ks at 773K. The limit of thermal stability was estimated to be about 700K for the preform wires.