1990 年 40 巻 8 号 p. 606-611
Sintered WC-W2C compacts were used as the substrate for diamond deposition, because the compacts were expected to be a carbon sink during CVD to improve the adhesion strength between diamond film and substrate. The adhesion strength has been found to be improved, as expected, with increasing W2C content in the range up to about 50%. The diamond deposited WC-(6-22)% W2C tools show the most excellent cutting performance for hyper-eutectic Al-20mass% Si alloy. The effects of W2C in the substrate are in detail discussed.