抄録
Relating to copper, the author observed the molecular binding of Cu-atoms formed by five grinding or polishing. In the unfinished stage of polishing, these molecules (provisionally so-called) construct the characteristic form of lattice, or stand in the certain orientational axis, which reflect the characteristic patterns as described in the previous report. When polishing comes to the final stage, these orientational structures collapse and the positions of Cu2-molecules become haphazard. By assuming simple cubic arrangment for these molecules, the calculated positions of statistical maximum of intensity in electron reflection show a good coincidence with the results of observations.
Following the interpretation of the present writer, the halo-ring patterns by polished surface of metals in electron diffraction are not due to the contour of surface, but to the inner structure though limited in very thin layer of surface, and that structure, so far as relating to copper, should be taken as the at-random arrangement of molecular binding of Cu-atoms.
