The Measurement of Recrystallization Texture in Copper by X-ray Diffraction and ECP

Abstract

In order to clarify the process of recrystallization, in particular, the secondary recrystallization in commercial copper, textures, microstructures and individual grain orientations have been examined by means of X-ray diffraction and scanning electron microscopy (SEM) and SEM-electron channeling pattern method.
Deformation textures of copper subjected to “straight rolling”, “zigzag rolling” and “reverse rolling” were very similar to one another. However, on “straight rolling”, the primary recrystallization texture of a fine grained sample showed a sharp cube orientation, while that of a coarse grained sample took a cube orientation mixed with a random one.
Secondary recrystallization probabilities were affected by the initial grain size, rolling procedure, annealing conditions and the ear produced by heavily rolling reduction. Most of the secondary recrystallization orientations obeyed Kronberg and Wilson’s rotation relationship. In addition, nearly a cube orientation was observed.
On “cross rolling”, deformation, primary and secondary recrystallization textures showed (110)[\bar223]+(001)[100], (519)[\bar4 11 1]+(110)[\bar223] and (110)[\bar223], respectively.
Some grains with orientations identical to those observed in the secondary recrystallization were found in the primary recrystallization sample with sharp cube orientations. Such grains were thought to relate to the secondary recrystallization.