Abstract
The wettability of reaction bonded SiC and hot pressed SiC by liquid pure metals such as Pb, Sn, Ge, Cu and Fe was investigated using the sessile drop method in Ar atmosphere.
Main results were as follows:
(1) Contact angles of liquid pure metals on SiC depended on the solubilities of Si and C in the liquid pure metals.
(2) The contact angles of liquid pure metals on the reaction bonded SiC which contained metallic Si differed from those on hot pressed SiC. It can be concluded that the higher the solubility of Si in liquid metals, the larger the difference in the contact angles on the reaction bonded SiC and on hot pressed SiC.
(3) Contact angle of liquid pure Ge on reaction bonded SiC showed a consderable temperature dependence and reached 0 deg. at a higher temperature. On the other hand, the higher contact angle on hot pressed SiC was still retained even at that temperature.
