1999 Volume 63 Issue 10 Pages 1338-1347
The effects of aging temperature and microstructure on the mechanical and physical properties of a Cu-9Ni-6Sn(mass%) alloy were investigated and the following results were obtained. The mechanical and physical properties such as tensile strength, elongation and electrical resistivity of the Cu-9Ni-6Sn alloy were strongly dependent on the aging temperature, aging time and microstructures. This alloy was much strengthened by aging at temperatures below 673 K where the spinodal decomposition occurs, but the specimen is not strengthened by aging at temperatures above 673 K where the discontinuous precipitate forms. The electrical resistivity was decreased by aging and the degree of reduction increased with increasing aging temperature and time. These results obtained in the present study indicate that the strengthening mechanisms of the Cu-9Ni-6Sn alloy are changed by the aging conditions.
