Abstract
The main purpose of this study was to clarify the process of dynamic recrystallization (DRX) of pure Al single crystals by using the synchrotron radiation (SR) Laue technique and the electron backscatter pattern (EBSP) technique. Compression tests were made at 473 K with an initial strain rate of 10−3 s−1 using a test machine designed to fit on the camera stage of Synchrotron Radiation apparatus at SPring 8-BL28B2. The ⟨111⟩ crystallographic orientation was chosen as the compression axis. During a compression test, transmission Laue spots were recorded. As plastic deformation of the crystal proceeded, the Laue spots of the matrix streaked toward the center of the film. Before the first stress peak, the streaks of the Laue spots reached a plateau. Just before the peak stress was reached, the brightness of the new spots from the DRX grain increased at the end parts of the streaks of the original Laue spots. After the stress peak, the Laue spots from the DRX grain suddenly brightened and streaked as those from the matrix disappeared. The crystallographic orientation relationship between the DRX grain and the matrix was mostly explained by analyzing the slip systems in the matrix. The misorientation of DRX grain boundaries might be slightly larger than that of the surrounding subgrain boundaries when DRX occurs. These observations imply that DRX is the process that a field which has a higher angle boundary than surrounding subgrain in the matrix grows during deformation.
