2020 年 46 巻 4 号 論文ID: 46-4-03
Al-Si alloy die-casting materials are expected to be used as a heat dissipation product (heat sink) for a head lamp of automobile, because of their superior castability. Their low thermal conductivity, however, hinders their use for a heat dissipation product. Currently, the heat dissipation property could be improved by surface treatments such as painting, however, it is important to improve the thermal conductivity of Al-Si alloy itself. In this research, the crystal growth of intermetallic compounds, which were formed in Al matric was controlled in order to increase the thermal conductivity. The novel Al-Si alloy was successfully developed under the collaboration research between academia and industry. This alloy had a large volume of intermetallic compounds in the microstructure, resulting in the decrease of solute content of solute atoms in Al matrix and then the increase of thermal conductivity.