2007 Volume 7 Issue 3 Pages 221-226
This paper proposes a new polishing tool used for the high efficiency thinning process of extremely thin quartz wafers and investigates its fundamental performance on the polishing of quartz material experimentally after its internal structure has been clarified by microscopic and SEM observation. This kind of tool is prepared by freezing a water-based MCF(Magnetic Compound Fluid)polishing liquid, a intelligent fluid composed of water-based MF (Magnetic Fluid), iron powder, abrasive particle and α-cellulose, with liquid nitrogen, and thus reacting to magnetic fields. An experimental apparatus developed previously was employed for the MCF polishing experiments of quartz wafers with dimensions of φ30mm×t0.75mm. The obtained results showed that (1) MCF polishing tool has much greater material removal ability after freezing than that before freeing; (2) Higher material removal rate can be obtained by using a frozen MCF polishing tool with larger abrasive particle but in this case the surface roughness gets worse; (3) Highest material removal rate and best surface roughness can be obtained when the percentage of water in the frozen MCF polishing tool was around 34.7%.
