Cyclic Stress Measurement Method Using Electrodeposited Copper Foil
(Static Stress Effect on Grain Nucleation and Grain Growth)

抄録

A copper electroplating stress measurement method is applied to an element that changes the biaxial stress ratio in the stress cycle over time. We originally produced a fatigue testing machine capable of producing the combined stress state of rotating bending and static torsion. The critical shearing stress and the grain growth rate were almost the same for the plane bending test and the rotating bending-static torsion test. These results mean that the static stress that is superposed on the cyclic stress has no effect on grain nucleation and grain growth.