Abstract
With the miniaturization of semiconductor packages, the surface inspection of the packages for defects such as voids, chip cracks and so on is becoming important. This paper describes a surface inspection of semiconductor packages using image processing technique. The presented inspection method uses 2D brightness distribution which is composed of brightness values of two images acquired under different lighting condition such as side lighting and coaxial lighting. On the 2D brightness distribution, the defect-free areas of part mark area and non-marked area are located in the different areas respectively, and the defect areas are distinguished from those defect-free areas. This technique does not need any reference images and is not affected by surface part marks. In this paper, a method using a color camera under different color lightings is also discussed in order to reduce the acquisition time of images.
