Journal of the Japan Society for Precision Engineering
Online ISSN : 1882-675X
Print ISSN : 0912-0289
ISSN-L : 0912-0289
Review
Current Status and Vision in Machining Technology of SiC Wafers for Power Devices
Kenji KAWATA
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Keywords: SiC wafer, power device, machining technology, slicing, grinding, lapping, CMP, wafer process, electrolytic polishing method
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2023 Volume 89 Issue 5 Pages 359-362

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