Abstract
Since ground surface is figured by overlapping of numberless grooves cut with individual grains on a grinding wheel, interference action is caused among these grooves reciprocally, while succeeding grains pass through nearby the grooves cut with preceding grains. In this paper, the interference action is studied by analyzing the profile of grooves cut in parallel with pyramidal tool of diamond. The main results are as follows: (1) In the range of pitch ratio γ>4, no interference action is caused, where γ is a ratio of interval between neighboring grooves to their ideal width at the level of the test surface. (2) In the range of γ<4, interference action is caused, i) Height ratio α, a ratio of height of piling-up peak to depth of the grooves, varies according to γ and indicates maximum value in the range of γ≈1.52. ii) Cut-off ratio β, a ratio of actual chip area to the ideal one, increases as γ decreases. iii) The angle of inclination of piling-up peak ψ increases as γ decreases.
