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Volume 36, Issue 429
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[in Japanese], [in Japanese]1970 Volume 36 Issue 429 Pages 651-656
Published: 1970
Released on J-STAGE: July 23, 2009
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Jisuke FUKAYA, Kiyoshi OISHI1970 Volume 36 Issue 429 Pages 657-662
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSThere reported several weighing apparatuses. According to their principle, the counter force against the acting one is caused by the displacement of the force-acting part. But, in the case of measuring the physical quantities, the movement of the sensing part is apt to make a change of initial condition. Then, when the measuring is wanted to be done without displacement of the part, the above method can not be applied.
In order to remedy the above demerit, a device including an integrating element is developed. By inserting the element, the control system becomes to be of so-called I-type, and the steady state deviation of the part can be theoretically removed.
The experiments on the behaviors of this device show good results: the device has no steady state deviation and the controlling system is stable and has quick response. In addition, an applicating experiment to this device to the reaction flow-meter has been done, and the result shows fairly good usefulness of this device.View full abstractDownload PDF (936K) -
1970 Volume 36 Issue 429 Pages 662
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSDownload PDF (157K) -
Cutting of Photo-Elastic Materials at Speeds over Elastic Distorsion Wave Propagation (Report 1)Akira YAMAMOTO, Shimesu NAKAMURA, Motosada KANDA1970 Volume 36 Issue 429 Pages 663-668
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSPolyurethan resins are cut orthogonally with a tool which is shot out in application of gas expansion, and variations of aspects of stress field induced by increasing cutting speed to the elastic wave propagation speed are observed by means of the dynamic photo-elastic method.
The main results are as followes ;
(1) When increasing cutting speed, the stress acting scope contracts in size and tends to flow away backward, and the compressive stress region ahead of tool edge is constricted to that edge. (2) The tangential force-normal force ratio decreases to some degrees at increasing speed. (3) A shock wave from a tool edge is observed at a cutting speed over distorsion wave propagation speed. Aspects of stress field are similar to that of fluid. (4) The figure of lower order isochromatic lines is somewhat close to the elastic solution of stress field caused by a moving point exerting oblique force with high speed across infinite plate. (5) The distorsion wave speed when it is a half of cutting speed is about fourfold larger than that speed which is calculated from static properties.View full abstractDownload PDF (4246K) -
Interference Phenomenon in Grinding with a Single Grain (1)Masaki MORI, Teruo OKAMOTO1970 Volume 36 Issue 429 Pages 669-675
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSSince ground surface is figured by overlapping of numberless grooves cut with individual grains on a grinding wheel, interference action is caused among these grooves reciprocally, while succeeding grains pass through nearby the grooves cut with preceding grains. In this paper, the interference action is studied by analyzing the profile of grooves cut in parallel with pyramidal tool of diamond. The main results are as follows: (1) In the range of pitch ratio γ>4, no interference action is caused, where γ is a ratio of interval between neighboring grooves to their ideal width at the level of the test surface. (2) In the range of γ<4, interference action is caused, i) Height ratio α, a ratio of height of piling-up peak to depth of the grooves, varies according to γ and indicates maximum value in the range of γ≈1.52. ii) Cut-off ratio β, a ratio of actual chip area to the ideal one, increases as γ decreases. iii) The angle of inclination of piling-up peak ψ increases as γ decreases.View full abstractDownload PDF (7042K) -
Tetsuya SUTO, Toru WAIDA, Toshio SATA1970 Volume 36 Issue 429 Pages 676-682
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSBehaviours of the active cutting edges on the grinding wheel during grinding are examined with the newly developed equipment. The light reflected from the surface of the grinding wheel is received by the photomultiplier whose output is amplified, sliced, and modulated in square wave form to give the position and the length of worn area of each cutting edges on the wheel surface. Tearing-out, fracturing, new-exposure, length of life, and growth of worn area of cutting edges are analysed by processing these data obtained with the specially prepared computer program. It has been found experimentally in high speed grinding that the probability of survival of active grains increases with increasing the grinding speed, and with decreasing the grain depth of cut, and that the worn area of the grains varies randomly with the grinding time independently of the grinding conditions.View full abstractDownload PDF (2578K) -
Study on Lapping Mechanisms of Si Single Crystal (2nd Report)Masayuki IKEDA1970 Volume 36 Issue 429 Pages 683-689
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSIt is widely known that the lapping is necessary to work the brittle materials such as Si single crystal. In this paper, the lapping mechanism of Si crystal is investigated by the aid of measuring the diameter of many grains crushed and analysing the variation of the grain size distribution during lapping. A few types of mechanisms about crushing of grains are discussed. The main results obtained are as follows:
(1) The large grains are crushed in the beginig period of the lapping time. In this period, the lapping is performed by grains acting the rolling motion and lapping removing rate is large. The mean diameter of grains decreases rapidly in this time.
(2) The ratio mean long diameter to mean short diameter of grains crushed is almost constant and its value is about 1.57.
(3) The formula calculating the number of grains is derived by using grain size distribution and the shape model of the abrasive grains proposed. This is the shape combined two hexagonal truncated pyramids in its base plane.
(4) The theoretical formula expressing the variation of the grain size distribution during lapping is obtained.View full abstractDownload PDF (3787K) -
Study on Laser Machining of Thin Films (1st Report)Satoshi NAKAYAMA, Minoru KASHIWABARA1970 Volume 36 Issue 429 Pages 690-696
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSOn micro-machining of thin metal films, the removal mechanism by focused laser beam irradiation and the dimensional appearances of removed holes are discussed analytically with reference to the energy distribution of the beam.
The relations between the beam factors and the hole diameters are represented as the nondimensional formula composed of beam size, beam power and power-threshold for machining. The effects of focal length and defocus distance are also disclosed by the formula.
From the experiments on machining chromium films on glass substrates, it is shown that the formula is applicable to the case of irradiation on focal plane.
The hole diameters are nearly constant regardless of the beam power when the minimum diameters are obtained at the focal plane. The roundness of holes is affected mainly by the radius of resonance mirrors and the beam power irradiated.View full abstractDownload PDF (8084K) -
[in Japanese], [in Japanese]1970 Volume 36 Issue 429 Pages 697-703
Published: 1970
Released on J-STAGE: July 23, 2009
JOURNAL FREE ACCESSDownload PDF (1312K)
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